ABOUT CONFERENCE:

International Conference on Biomaterials Science and Tissue Engineering (ICBST-23) is focused on the innovatory approach for innovation and invention in Biomaterials Science and Tissue Engineering. ICBST-23 aims to proclaim knowledge and share new ideas amongst the professionals, industrialists, and students from research areas of Biomaterials Science and Tissue Engineering to share their research experiences and indulge in interactive discussions and technical sessions at the event. The conference will be a platform to globalize one research, share scientific experiences, to gain knowledge of new technologies and regulations. The conference is scheduled for July 24-26, 2023 in Osaka, Japan. We invite sponsors and exhibitors to showcase your products to our participants and make them reach the public through them. We request you make use of this opportunity to make the world a better place to live in.

WHAT IS NEW?

ICBST-23 includes international attendee workshops, lectures, and symposia, including a designated registration area, a refreshment break, and a gala lunch. So, join leading experts and allied professionals from July 24-26, 2023 in Osaka, Japan to keep up with the rapidly accelerating pace of change that is already impacting the field of Biomaterials Science and Tissue Engineering.

WHY ATTEND?

ICBST-23 offers a beautiful opportunity to meet and enhance new contacts in the field of Plant Science and Food Technology, by providing mutual collaboration and break-out rooms with tea, coffee, snacks, and lunch for delegates between sessions with invaluable networking time for you. It allows delegates to have issues addressed by Biomaterials Science and Tissue Engineering global experts who are up to date with the latest developments in this field and provide information on new advancements and other technologies. This International conference features world-renowned keynote speakers, plenary speeches, young research forums, poster presentations, technical workshops, and career guidance sessions.